Other polymer and owder applications

A number of industrial applications demand micronised polymer and other powders that have been produced to controlled particle sizes, but they also have a number of other specialised uses.

For example, low density filters and bond line thickness control additives are often used in speciality adhesives, where a consistent gap is required. Currently in use as a bond line thickness additive/ filler is a polypropylene powder of consistent particle size HM 20/70G.

Other applications include mildly abrasive hand cleaners and deflashing, deburring and surface conditioners, and static eliminating anti-slip additives. Oil-drilling applications frequently utilise loss circulation control additives, while low specific gravity fillers are often used in vinyl compound adhesives and thermosetting resins.

The olive stone grits EFOG, FOG and OSF are used in a number of these applications.